频率：24MHZ
尺寸：5.0x3.2mm
BQCSC系列晶振,5032mm,BQCSC-24MF-DBBGT,24MHZ,Bliley智能手机晶振特点:
SMD石英晶振结构
标准5.0x3.2mm包装尺寸
高温高稳定性
BQCSC系列晶振,5032mm,BQCSC-24MF-DBBGT,24MHZ,Bliley智能手机晶振 参数表
| Parameter | Conditions Fundamental 3rd overtone Unit | |||||||||||||||||||
| Frequency Range | 24.0 MHz | |||||||||||||||||||
| Frequency Tolerance | @ + 25 ℃ ±50 Max (see options) ppm | |||||||||||||||||||
| Frequency Stability | ±100 Max (see options) ppm | |||||||||||||||||||
| Aging | Max 1st Year ±3.0 ppm | |||||||||||||||||||
|
Equivalent Series Resistance (max) |
8.0 – 12.0 MHz 100 Ω | |||||||||||||||||||
| 13.0 – 20.0 MHz 80 Ω | ||||||||||||||||||||
| 20.0 – 29.0 MHz 50 Ω | ||||||||||||||||||||
| 30.0 – 60.0 MHz 40 Ω | ||||||||||||||||||||
| 40.0 – 150.0 MHz 80 Ω | ||||||||||||||||||||
| Insulative Resistance | Min @ 100Vdc ±15Vdc 500 MΩ | |||||||||||||||||||
| Drive Level | 10 Typ, 200 Max μW | |||||||||||||||||||
| C0 (Shunt Capacitance) | Max 5.0 pF | |||||||||||||||||||
| CL (Load Capacitance) | Per Option (typical) 6-20 (see options) pF | |||||||||||||||||||
| DLD | 50nW to 100µW ±10 Max ppm | |||||||||||||||||||
| RLD | 50nW to 100µW 20% Max Ω | |||||||||||||||||||
| Operating Temp Range | -20 to +70 / -40 to +85 ℃ | |||||||||||||||||||
| Storage Temp Range | -55 to +125 ℃ | |||||||||||||||||||
| Sealing Method | Seam Weld | |||||||||||||||||||
| Moisture Sensitivity Level | 1 | |||||||||||||||||||
BQCSC系列晶振,5032mm,BQCSC-24MF-DBBGT,24MHZ,Bliley智能手机晶振 尺寸图
深圳市龙湖电子有限公司
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